HJT TECHNOLOGY

WHY CHOOSE HJT?

Type P

PERC

21~23%

N-type (Mono-Si)

TOPCon

24.5~26.0%

10+ manufacturing steps

800℃+ processing temperature

High carbon footprint

HJT

25.5~27%

Only 4 manufacturing steps

200℃ processing temperature

Lower carbon footprint

BC

25.5~27.5%

More complex manufacturing steps

800℃+ processing temp.

High carbon footprint

Low yield rate

Mainstream PV Cell Technologies

HJT + Perovskite Tandem

28~43%

HJT: the optimal platform for perovskite tandem integration

Ultra-high efficiency

Low-temp. processing

Future

HIGHER EFFICIECNY

24.47%

Module Champion Efficiency

Silver-grid
HJT Module

Copper-grid
HJT Module

Cell Efficiency Gain

Module Power Increase

Efficiency, Defined by Heterojunction

HJT technology combines crystalline silicon with ultra-thin amorphous silicon layers on both sides of the wafer. The intrinsic and doped a-Si layers form the critical heterojunction interface, effectively passivating the silicon surface, minimizing energy losses, and unlocking higher conversion efficiency. Dinto Solar has achieved a champion HJT cell efficiency of 26.9% and a module efficiency of 24.47%.

Higher Efficiency Enabled by Copper Metallization

Copper-based metallization in HJT cells replaces silver-coated copper designs with ultra-narrow gridlines and significantly lower resistivity, reducing shading losses and improving current collection, thereby enhancing both conversion efficiency and module power output. Compared with typical silver-coated copper cells, copper-metallized HJT (C-HJT) delivers an efficiency gain of 0.5% at the cell level and a module power increase of 10 W.

MORE POWER GENERATION

-0.24%/°C

Industry Leading Temperature Coefficient

Hot Climate

SUNRISE

NOON

SUNSET

Average daily power generation
increased by over 3%

+2~5%

Higher Bifacial Energy Yield Gain

TOPCon

80%

DintoSolar HJT

90%

Direct Sunlight

Diffuse Sunlight On Back Of Panel

Sunlight Reflected Off Ground To Back Of Panel

≤9.7%

Lower Module Degradation

≤1%

degradation in the first year

≥90.3%

of power maintained after 30 yrs

99%

91.8%

90.3%

Excellent Temperature Coefficient

HJT modules feature an industry-leading temperature coefficient of -0.24%/℃, significantly outperforming other modules. Under high temperature and high irradiance, HJT modules maintain higher output, providing more stable performance and greater annual energy yield.

Higher Bifacial Energy Yield Gain

Dinto Solar’s HJT modules achieve a stable bifaciality of 90% ±5%. Both sides of the n-type silicon wafer are coated with identical intrinsic and doped a-Si layers and TCO films, enabling rear-side efficiency nearly equal to the front. Compared with TOPCon modules, HJT modules achieve approximately 2–5% higher bifacial energy yield.

Lower Module Degradation

Thanks to n-type wafers and low-temperature fabrication, HJT modules effectively eliminate LID and PID. First-year degradation is below 1%, and over 30 years total degradation is ≤9.7%, ensuring stable long-term power output and reliable investment returns.

Superior Low-Light Performance

HJT modules deliver excellent short-wavelength response and high open-circuit voltage (~750 mV, 20–30 mV higher than other technologies). Interface passivation and symmetric structure enable all-direction light capture, extending daily generation and boosting lifetime energy yield.

Copper Gridlines: Reduced Shading Area

Copper gridlines with a linewidth of 15 μm reduce shading
area by 30%, improving HJT cell efficiency and module power output.

Silver Gridlines

Copper Gridlines

30%↓

Shading area reduced

Copper Gridlines: Enhanced Conductivity

Contact resistance reduced by 37.5% and resistivity by 62.3%. The combination of ultra-narrow
gridlines and low resistivity enhances current collection, improving HJT cell efficiency and module power output.

37.5%↓

Contact resistance decreased

62.3%↓

Resistivity decreased

Contact resistivity

Gridline resistivity

Superior Low-Light Performance

HJT modules deliver excellent short-wavelength response and high open-circuit voltage (~750 mV, 20–30 mV higher than other technologies). Interface passivation and symmetric structure enable all-direction light capture, extending daily generation and boosting lifetime energy yield.

Copper Gridlines: Reduced Shading Area

Copper gridlines with a linewidth of 15 μm reduce shading
area by 30%, improving HJT cell efficiency and module power output.

Copper Gridlines: Enhanced Conductivity

Contact resistance reduced by 37.5% and resistivity by 62.3%. The combination of ultra-narrow
gridlines and low resistivity enhances current collection, improving HJT cell efficiency and module power output.

HIGHER RELIABILITY

Butyl Sealant (PIB) + Dual-glass

Innovative butyl sealant and double-sided coated glass enhance module sealing, ensuring exceptional moisture resistance.

<4%

DH3000 Degradation

DH1000

2.1%

DH2000

2.8%

DH3000

3.9%

Film

Glass

Frame

Cell

Glass

Film

PIB

Light Conversion Film

The HJT module is encapsulated with light conversion film
that converts UV light (<380 nm) to blue light (~400-550 nm).
This feature significantly enhances the module's UV resistance.

UV180 <3%

Sample 1

Sample 2

Sample 3

Sample 4

IR

UV

Light Conversion Film

Solar Cells

Copper Gridlines: Ultra-High Soldering Pull Strength

Dynamic Pull Force Curve

Copper Grille C-HJT

Traditional HJT

1.8N

Avg. Upper Limit

Avg. Lower Limit

1.0N

1.0N

Avg. Upper Limit

1.0N

Avg. Lower Limit

Copper Gridlines: Superior Microcrack Resistance

Stronger Module Resistance to Microcracks

Continued Power Generation After Cell Cracking

Enhanced Hot-Spot Resistance at Module Level

Butyl Sealant (PIB) + Dual-glass

Innovative butyl sealant and double-sided coated glass enhance module sealing, ensuring exceptional moisture resistance.

Light Conversion Film

The HJT module is encapsulated with light conversion film
that converts UV light (<380 nm) to blue light (~400-550 nm).
This feature significantly enhances the module's UV resistance.

Copper Gridlines: Ultra-High Soldering Pull Strength

Copper Gridlines: Superior Microcrack Resistance

LOWER CARBON FOOTPRINT

Thinner Silicon Wafer

90-110μm

HJT / C-HJT

Streamlined Manufacturing Process

HJT technology requires only four core process steps, significantly fewer than the more than ten steps required for TOPCon and BC technologies. This results in higher yield, lower energy consumption, and improved process controllability.

HJT / C-HJT

4 Steps

TOPCon / BC

10+ Steps

Texturing & Cleaning

PECVD

PVD

Metallization Patterning

Low-Temperature Processing

All key production steps are completed at temperatures below 200°C, enabling the use of thinner silicon wafers while minimizing thermal damage and high-temperature diffusion, thereby substantially reducing silicon material consumption, overall energy costs, and the carbon footprint.

200°C

HJT

800°C

Other Solar Cells

Silver-free Solar Cell Manufacturing

Silver

155 kg CO₂/kg

Copper

3.97 kg CO₂/kg

• Silver-free C-HJT mass production cuts the carbon footprint of copper to just 2.56% of silver, significantly lowering overall emissions.
• Copper delivers electrical conductivity and mechanical strength comparable to silver, yet is 1,600 times more abundant and costs only one-tenth as much — making it an ideal, sustainable choice for the solar industry.

Thinner Silicon Wafer

HJT cells utilize thinner silicon wafers, minimizing thermal damage and eliminating the need for high-temperature diffusion. This significantly reduces silicon consumption and overall energy usage, resulting in lower costs and a markedly reduced carbon footprint.

Streamlined Manufacturing Process

HJT technology requires only four core process steps, significantly fewer than the more than ten steps required for TOPCon and BC technologies. This results in higher yield, lower energy consumption, and improved process controllability.

Low-Temperature Processing

All key production steps are completed at temperatures below 200°C, enabling the use of thinner silicon wafers while minimizing thermal damage and high-temperature diffusion, thereby substantially reducing silicon material consumption, overall energy costs, and the carbon footprint.

Silver-free Solar Cell Manufacturing

Silver-free C-HJT mass production cuts the carbon footprint of copper to just 2.56% of silver, significantly lowering overall emissions.
Copper delivers electrical conductivity and mechanical strength comparable to silver, yet is 1,600 times more abundant and costs only one-tenth as much — making it an ideal, sustainable choice for the solar industry.

Dinto Solar HJT Solar Technology Roadmap

HJT Cell Tech

• Low-temperature gettering
• Multi-layer interfacial passivation films
• Double-sided microcrystalline silicon
• High-efficiency TCO thin films
• Rear-side polishing
• Edge passivation optimization
• 110 μm ultra-thin wafer mass production
• Ultra-narrow gridline printing
• High-precision copper gridlines
• HJT–perovskite tandem

HJT Module Tech

• Half-cut cells
• 1/3-cut cells
• Super Multi-Busbar (SMBB)
• Zero Busbar (0BB)
• Flexible interconnection
• Full-screen module design
• High-reflectivity triangular solder ribbons
• High-transmittance coated glass
• High-reliability encapsulation
• Lightweight & flexible encapsulation

C-HJT 1.0

1/3-cut + C-HJT 2.0

HJT–perovskite Tandem

≥ 23.18%

Module Efficiency

720W+

Module Power

2024

≥ 23.99%

Module Efficiency

745W+

Module Power

2025

≥ 24.47%

Module Efficiency

760W+

Module Power

2026

≥ 25.11%

Module Efficiency

780W+

Module Power

2027

≥ 25.75%

Module Efficiency

800W+

Module Power

2028

≥ 27.36%

Module Efficiency

850W+

Module Power

2029

≥ 32.20%

Module Efficiency

1000W+

Module Power

2030